Fw: [computational.science] CFP: 12th ACM Solid and Physical Modeling Symposium

> 12th ACM Solid and Physical Modeling Symposium
>
> http://cg.cs.tsinghua.edu.cn/spm2007/cfp.htm
>
> >
> >
> > Tsinghua University, Beijing
> > 4-6th June 2007
> >
> > Since its inception in 1991, the ACM Symposium on Solid Modeling
> > and Applications has been the primary venue for disseminating
> > research results in the design, representation, analysis,
> > visualization, and use of digital models of real or planned solid
> > objects and their bounding surfaces. Actually, solid modeling entails
> > not only modeling their geometric shape, but also their physical
> > properties and behaviors. To emphasize this broader mission, the
> > name of the Symposium was expanded to Solid and Physical Modeling
> > (SPM) in 2005. SPM seeks submissions from academic, industrial and
> > government researchers that present new results regarding the analysis,
> > simulation, modeling, and animation of the behavior of objects; and
> > the properties of objects as functions of space and time in response
> > to interactions with human users, operators or the physical environment.
> >
> > Conference Topics
> >
> > Topics of interest include, but are not limited to:
> > * Biomedical applications
> > * Curves and surfaces
> > * Dimensioning, tolerancing and constraints
> > * Geo-scientific applications and oil exploration
> > * Interaction and virtual environment
> > * Mesh processing
> > * Physically based modeling
> > * Product data standards and interoperability
> > * Reverse engineering
> > * Shape analysis
> > * Simulation
> >
> > Invited Speakers
> > * Herbert Edelsbrunner, Duke University, USA
> > * Gershon Elber, Technion, Israel
> > 00 * Shing-Tung Yau, Harvard University, USA
> >
> > Pierre B.6zier Prize
> >
> > The first annual Pierre Bezier Prize will be awarded at ACM SPM 2007
> > for contributions to solid, shape and physical modeling.
> >
> > UGS Best Paper Award
> >
> > UGS Corporation are again very generously sponsoring prizes for the
> > best papers at the Symposium. Two best papers selected by a Prize
> > Committee will share the prize of US$3000.
> >
> > Republication in Journals
> >
> > Some papers of outstanding quality that have been presented at ACM
> > SPM 2007 will be selected for publication in an extended and revised
> > form in journals of Computer Aided Geometric Design, Computer Aided
> > Design and IEEE Transactions of Automation Science and Technology.
> >
> > Important Dates
> >
> > * Abstracts due: November 1, 2006
> > * Full papers due: November 15, 2006
> > * Acceptance decisions: January 10, 2007
> > * Final versions due: March 1, 2007
> >
> > Information for Authors
> >
> > The Proceedings will be published by ACM Press. More information about
> > paper submission and format templates will be available at
> > http://cg.cs.tsinghua.edu.cn/spm2007/.
> >
> > Conference Organization
> >
> > Honorary Conference Chairs
> > 0000Chris Hoffmann, Purdue University, USA
> > 0000Jia-Guang Sun, NSFC, China
> >
> > Conference Co-Chairs:
> > 0000Shi-Min Hu, Tsinghua?University, China
> > 0000Hong Qin, Stony Brook University, USA
> >
> > Program Co-Chairs:
> > Bruno Levy, INRIA Loraine, France
> > Dinesh Manocha, Univ. of North Carolina, USA
> >
> > Program Committee Members:
> > Pierre Alliez, INRIA, France
> > Cecil Armstrong, Queen's University Belfast, UK
> > Hujun Bao, Zhejiang University, China
> > Alexander Belyaev, MPI, Germany
> > George-Pierre Bonneau, GRAVIR-IMAG, France
> > Oliver Brock, University of Massachusetts Amherst, USA
> > Wim Bronsvoort, Delft University of Technology, The Netherlands
> > Steven Cameron, Oxford University, UK
> > Marie-Paule Cani, INP Grenoble, France, France
> > Frederic Cazals, INRIA Geometrica, France
> > Raphaelle Chaine, CNRS, France
> > Falai Chen, Univ. of Science and Technology, China
> > Fuhua (Frank) Cheng, University of Kentucky, USA
> > Young Choi, Chung Ang University, Korea
> > Danny Cohen-Or, Tel Aviv University, Isreal
> > Elaine Cohen, University of Utah, USA
> > Jonathan Corney, Heriot Watt University, UK
> > Xavier Decoret, INRIA - ARTIS, France
> > Leila De Floriani, University of Genova, Italy
> > Tamal Dey, Ohio State University, USA
> > Deba Dutta, University of Michigan, USA
> > Ramsay Dyer, Simon Fraser University, Canada
> > Herbert Edelsbrunner, Duke University, USA
> > Gershon Elber, Technion, Israel
> > Anath Fisher, Technion, Israel
> > Craig Gotsman, Technion, Israel
> > Xianfeng Gu, Stony Brook University, USA
> > Baining Guo, Microsoft Research Asia, China
> > Soon-Hung Han, KAIST, Korea
> > Masuda Hiroshi, University of Tokyo, Japan
> > Chris Hoffmann, Purdue University, USA
> > Imre Horvath, Delft Univ. of Tech., The Netherlands
> > Tao Ju, Washington University at St. Louis, USA
> > Takashi Kanai, University of Tokyo, Japan
> > David Kasik, Boeing, USA
> > John Keyser, Texas A&M, USA
> > Deok-Soo Kim, Hanyang University, South Korea
> > Myung-Soo Kim, Seoul National Univ., South Korea
> > Young Kim, Ewha University, South Korea
> > Leif Kobbelt, RWTH Aachen, Germany
> > Shankar Krishnan, AT&T Labs, USA
> > Suresh Krishnan, University of Wisconsin, USA
> > Jean-Claude Latombe, Stanford University, USA
> > Kunwoo Lee, Seoul National University, South Korea
> > Kwan-Haeng Lee, GIST, South Korea
> > Andre Lieutier, Dassault, France
> > Yong-Jin Liu, Tsinghua University, China
> > Takashi Maekawa, Yokohama National Univ., Japan
> > Ralph Martin, Cardiff University, UK
> > Gopi Meenakshisundaram, UC Irvine, USA
> > Miguel Otaduy, ETH-Zurich, Switzerland
> > Nicholas Patrikalakis#(MIT, USA
> > Jorg Peters, University of Florida, USA
> > Hartmut Prautzsch, Karlsruhe University, Germany
> > Karthik Ramani, Purdue University, USA
> > Ari Rappoport, Hebrew University of Jerusalem, Israel
> > Stephane Redon, INRIA, France
> > Bill Regli, Drexel University, USA
> > Jarek Rossignac, Georgia Tech, USA
> > Malcolm Sabin, Numerical Geometry, UK
> > Hans-Peter Seidel, MPI, Germany
> > Vadim Shapiro, University of Wisconsin, USA
> > Alla Sheffer, University of British Columbia, Canada
> > Kenji Shimada, Carnegie Mellon University, USA
> > Hayong Shin, KAIST, Daejon, South Korea
> > Ram Sriram, NIST, USA
> > Neil Stewart, University of Montreal, Canada
> > Avneesh Sud, University of North Carolina, USA
> > Hiromasa Suzuki, Tokyo University, Japan
> > Chiew-Lan Tai, Hong Kong Univ. of Science and Tech.
> > Kai Tang, Hong Kong Univ. of Science and Technology
> > Sivan Toledo, Tel-Aviv University, Isreal
> > Nicolas Tsingos, INRIA-REVES, France
> > George Turkiyyah, University of Washington, USA
> > Jan H. Vandenbrande, Boeing, USA
> > Amitabh Varshney, University of Maryland, USA
> > Alvar Vinacua, Polytechnic Univ. of Catalunya, Spain
> > Don Vossler, UGS Corp., USA
> > Charlie C. L. Wang, Chinese University of Hong Kong
> > Enhua Wu, Macau University, China
> > Zongmin Wu, Fudan University, China
> > Sungeui Yoon, Lawrence Livermore Labs, USA
> > Jun-Hai Yong, Tsinghua University, China
> > Michael Yu Wang, ChineseUniversity of Hong Kong
> > Jovan Zagajac, Ford Motor Company, USA
> > Cai-Ming Zhang, Shandong University, China
> > Jianmin Zheng, Nanyang Technological Univ., Singapore
> > Denis Zorin, New York University, USA
>
>
Received on Tue Sep 26 09:53:16 2006