odlew-pl: konferencje ASM

Autor: Krzysztof Jan Huebner <hubner_at_IOd.krakow.pl>
Data: Tue 09 Nov 1999 - 09:17:22 MET
Message-ID: <Pine.SUN.3.91.991109085105.7723A-600000@czapla>
Content-Type: MULTIPART/MIXED; BOUNDARY="1920393722-595447846-942135442=:7723"

dzien dobry,

przesylam w plikach typu "*.htm" informacje o konferencjach
organizowanych przez ASM-International,
szczegolnie pragne zwrocic uwage wszystkich odlewnikow na 33rd Annual IMS
Convention 8 -12 October, 2000 St.Louis, Missouri, USA,
tytul konferencji "From Castings to Composites, Products, Processes and
Structure" patrz plik "confasm.htm"

pozdrowienia

Krzysztof Jan Huebner

<hubner@IOd.krakow.pl> :-)

Instytut Odlewnictwa
ul Zakopianska 73 telefon (0-12) 2618111 wew 356
30-418 Krakow faks (0-12) 2660870

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<h2 align="center"> ASM Calendar of Events</h2>
<CENTER>
 Industry's Choice for Networking,
 Practical Answers 
 and Advances in Materials Science and R & D
 1999
</CENTER>

<ul>
 <li><a href="http://www.nm-materials.org" target="_blank">Rio Grande Symposium
 on Advanced Materials</a> 11 October, Albuquerque, New Mexico
 <li><A HREF="#ims">32nd Annual Convention of the International Metallographic
 Society</A> (IMS) 31 October - 3 November, Cincinnati, Ohio
 <li>Materials Solutions Conference and Exposition
 1 - 4 November, Cincinnati, Ohio
 <li>19th Heat Treating Society Conference and Exposition
 1 - 4 November, Cincinnati, Ohio
 <li><A HREF="#istfa">25th International Symposium for Testing and Failure
 Analysis</A> 14 - 19 November, Santa Clara, California
</ul>
2000
<ul>
 <li><a href="confcldr.htm#mat-xxi">Materials XXI - Part I - Market Needs
 for the 21st Century</a> 18-19 January, Cleveland, Ohio
 <li>International Brazing and Soldering Conference
 2-5 April, Albuquerque, New Mexico
 <li>International Thermal Spray Conference and Exposition 8 - 11 May,
 Montreal, Quebec, Canada
 <li>Failure Prevention Through Education: Getting to the Root Cause 22-25
 May, Cleveland, Ohio
 <li>ASM International Heat Treat Congress - Europe 7-9 June, Gothenburg,
 Sweden
 <li>11th AeroMat Conference and Exposition 26-29
 June, Seattle, Washington
 <li>20th Heat Treating Society Conference and Exposition 9 - 12 October,
 St. Louis, Missouri
 <li>Materials Solutions Conference and Exposition 9 - 12 October, St.
 Louis, Missouri
 <li>33nd Annual Convention of the International Metallographic Society
 (IMS) 9 - 12 October, St. Louis, Missouri
 <li>26th International Symposium for Testing and Failure Analysis 12-16
 November, Seattle, Washington
</ul>
2001
<ul>
 <li>International Thermal Spray Conference & Exposition (ITSC) 28
 May - 1 June, Singapore International Convention and Exhibition Centre</li>
 <li>ImagingTech date and location to be determined</li>
 <li>34th IMS Annual Convention date and location to be determined</li>
 <li>12th AeroMat Conference & Exposition date and location to be
 determined</li>
 <li>Thermal Spray Executive Briefing date and location to be determined</li>
 <li>ASM Materials Solutions Conference and Exposition 5-8 November, Indianapolis,
 Indiana</li>
 <li>21st Heat Treating Society Conference and Exposition 5-8 November,
 Indianapolis, Indiana</li>
 <li>27th ISTFA date and location to be determined</li>
 <li>Trends in Welding Research date and location to be determined</li>
</ul>
2002
<ul>
 <li>Failure Prevention Through Education: Getting to the Root Cause date
 and location to be determined</li>
 <li>35th IMS Annual Convention date and location to be determined</li>
 <li>13th AeroMat Conference & Exposition date and location to be
 determined</li>
 <li>ASM Materials Solutions Conference and Exposition date and location
 to be determined</li>
 <li>22st Heat Treating Society Conference and Exposition date and location
 to be determined</li>
 <li>International Thermal Spray Conference and Exhibition date and location
 in Europe to be determined</li>
 <li>28th ISTFA date and location to be determined</li>
</ul>
2003
<ul>
 <li>14th AeroMat Conference & Exposition date and location to be
 determined</li>
 <li>2nd International Brazing and Soldering Conference date and location
 to be determined</li>
 <li>36th IMS Annual Convention date and location to be determined</li>
 <li>ASM Materials Solutions Conference and Exposition date and location
 to be determined</li>
 <li>23st Heat Treating Society Conference and Exposition date and location
 to be determined</li>
 <li>International Thermal Spray Conference and Exhibition date and location
 in North America to be determined</li>
 <li>29th ISTFA date and location to be determined</li>
</ul>
<hr>
<a name="ims">32st IMS Annual Convention</a> 
 31 October - 3 November 1999 Cincinnati, Ohio Cincinnati Convention
 Center

 -or-


"Understanding Processing-Structure-Property Behavior Corrections",
 the theme for the 1999 International Metallographic Society Convention. With
 a program featuring some of the leading experts in the field of metallography,
 it also includes several tutorials on in-service fractures and workshops on
 color etching and optical microscopy. This event provides practical, how-to
 information as well as a forum for the presentation of research. 
<hr width="65%">
<a name="htscty"></a>19th Heat Treating Society Conference &
 Exposition 
 1 - 4 November 1999 Cincinnati, Ohio Cincinnati Convention Center


 -or-


This premiere event is sponsored by the Heat Treating Society, an Affiliate
 Society of ASM International, and co-sponsored by more than a dozen recognized
 world-wide heat treating organizations. The 1999 event has two distinct parallel
 programming tracks, to cover both the practical "hands-on" aspects
 of heat treating and the latest research developments. 
<hr width="65%">
<a name="matsol"></a>ASM Materials Solutions Conference 
 1 - 4 November 1999 Cincinnati, Ohio Cincinnati Center 

 -or-

Materials Solutions, ASMs new conference designed to bring you practical
 information you can use, will highlight surface modification technologies; materials
 challenges in the automotive industry; a special Thermal Spray symposium; programs
 on brazing technology; manufacturing technology; and gas turbines. As part of
 the complete "Metals and Materials Experience", Materials Solutions
 provides a unique cross-disciplinary forum for the materials science community.

<hr width="65%">
<a name="istfa"></a>25th International Symposium for Testing
 and Failure Analysis Conference 
 14 - 18 November 1999 Santa Clara, California Santa Clara Convention
 Center 


ISTFA, the (International Symposium for Testing and Failure Analysis),
 continues as the leading forum on failure analysis of semiconductors and other
 microelectronic devices. Technical sessions, panel discussions, practical workshops
 and an equipment exposition combine to form a unique learning environment for
 anyone working to detect, understand and eliminate failures. Sponsored by EDFAS
 (Electronic Device Failure Analysis Society), an Affiliate Society of ASM International.
<a name="mat-xxi"></a>Materials XXI 
 18-19 January Cleveland, Ohio

 -or- 
You've always trusted ASM International for "Information that goes to
 work." Now, through an innovative two-day event, you can trust ASM for
 insights that will affect the way you work during the next decade and beyond.
 "Materials XXI," a forum and briefing for your top executives,
 to be held 18-19 January 2000 in Cleveland, Ohio.
<a name="isbc"></a>International Soldering & Brazing Conference
 
 2-5 April Albuquerque, New Mexico 

Recognizing the growing importance of brazing and soldering in the advancement
 of materials, endorsing sponsorsThe German Welding Society (DVS), Japan
 Welding Society, and the European Association for Brazing and Soldering (EABS)have
 joined in support of this new initiative. A comprehensive 3-day technical conference
 and exhibit has been organized that will bring together everyone from scientists
 and engineers, to production managers and operators involved in the research,
 development and application of brazing and soldering. And, it will provide you
 with an international forum in which to share your company's innovations in
 these joining technologies. 
<hr size="3" width="75%">
<a name="aeromat"></a>11th AeroMat Conference and Exposition
 
 26-29 June Seattle, Washington

AeroMat is widely recognized as the premiere event for anyone interested in
 technology advances in aerospace materials, processes and designs. Without exception,
 AeroMat 2000 of will offer a broad spectrum of distinctive aerospace related
 symposia. The technical conference and exposition will focus on the technology
 drivers that will influence the aerospace industrys performance and productivity
 in the 21st century. 
<hr width="65%">
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<title>Materials Solutions 2000 - Advanced Particulate Materials: Call for Papers</title>

<META NAME="description" Content="ASM International is the society for materials engineers, a worldwide network dedicated to advancing industry, technology, and applications of metals and materials. Through the efforts and involvement of our members, ASM develops and distributes timely, useful, reliable technical information through electronic media, publications, conferences, training programs, and chapter activities.">
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Call
 for Papers

<h3 align="center"> Materials
 Solutions 2000 
 </h3>

October 9-12, 2000 
 Cervantes Convention Center 
 St. Louis, MO 
<HR WIDTH=75% SIZE=2 noshade>
 Conference First
 Announcement & Call for Papers 
Deadline for receipt of abstracts is February 15, 2000. 
<blockquote>
 Why Materials Solutions? 
 Sponsored by ASM International, the premiere Materials Information Society,
 our Materials Solutions Conference & Exposition is THE international engineered
 materials and processes event at which to present your work to hundreds of
 delegates from industry, government and academia. 
 The ASM Technical Programming Board is pleased to invite contributions for
 consideration, to a Symposia covering the development and processing of components
 utilizing advanced particulate materials, which will address the following
 topics:
 <ul>
 <li> Rapid prototyping and tooling using powder methods </li>
 <li> Application of advanced coatings using particulate materials processing
 </li>
 <li> Powder injection molding </li>
 <li> Demanding applications for particulate materials </li>
 <li> High precision in particulate materials components </li>
 <li> Development of layered structures </li>
 <li> High density processing </li>
 <li> Innovative manufacturing methods using particulate materials </li>
 <li> Particulate hard materials for cutting and wear-resistent applications
 </li>
 </ul>
 Where possible, relevance to one of the following four industrial focus areas
 is requested. Presentations outside of the above listed topics are also welcome.
 
 <ul>
 <li> Automotive & Truck </li>
 <li> Aerospace & Defense </li>
 <li> Energy & Power </li>
 <li> Heavy Equipment, Machinery, & Durable Goods </li>
 </ul>
 <blockquote>
 Deadline for receipt of abstracts is February 15, 2000.
 </blockquote>
 Submit your abstract by February 15, 2000 and your name will be entered
 into a drawing, and you will be eligible to win a complimentary registration
 to Materials Solutions 2000. To maintain the integrity of this event, please
 carefully consider your ability to present your work at the conference before
 submitting your abstract. All costs associated with your participation at
 Materials Solutions will be at your expense, including travel, housing, and
 a (reduced) registration fee. 
 Abstract Guidelines
 <ol>
 <li> Type the titles of the conference, program, topic, and your proposed
 presentation followed by your 150-200 word abstract, in English. Include
 the significance of the presentation content, conclusions and benefits.
 </li>
 <li> For the presenting author first (please underscore name), followed
 by all co-authors of the paper, type: the complete name (including Dr./Mr./Mrs./Ms./Prof.
 etc.), title, affiliation, complete mailing address (no box numbers), telephone
 and fax numbers, and e-mail address. This information must be included
 with your abstract. </li>
 <li> Submit your abstract before February 15, 2000, online at the ASM website
 (www.asm-intl.org), click on "Call for Papers" and follow the instructions.
 Mail your abstract to Materials Solutions 2000, Conference Coordinator,
 ASM International, Materials Park, Ohio 44073-0002, or fax it to 440.338.4634.
 </li>
 </ol>
 Paper Requirements & Proceedings 
 Due to the industrial nature of this conference, manuscripts are not required
 in order to present. However, for those who would like to be published, Materials
 Solutions 2000 Conference manuscripts can be presented in one of ASM's technical
 journals, following the conference. All manuscripts submitted to a technical
 journal will be reviewed according to the selected journal's standard review
 procedure. Please indicate if you wish to be published when submitting your
 abstract so that we can send you Author Instructions. 
 Note: Manuscripts will be required in electronic format. Also, you must
 physically present your paper at the Conference if you wish to be published.
 
</blockquote>
<HR WIDTH=65%>
<blockquote>
 Online Abstract Submission 
 If you would like to submit your paper for consideration electronically, please
 review our Guidelines for Online paper submission
 before proceeding to our <A HREF="../absub/absubmit.htm">Abstract Submission
 Form</A>. You must use a browser that supports forms to take advantage of
 this method. 
 Hard Copy Abstract Submission 
 If you prefer to submit your abstract via mail or fax, please send it to the
 attention of ASM Conference Coordinator, 9639 Kinsman Rd., Materials Park,
 OH 44073-0002 Fax 440-338-4634. Abstracts submitted in hard copy should include
 up to 250 words and any relevant graphs, charts or other support data; the
 topic for which the paper is being submitted; the proposed title, conclusions
 and significance of the paper; and, the following information about the author
 and all co-authors: name, title, company/affiliation, complete address, phone
 and fax number, and e-mail address. 
</blockquote>

<blockquote>
 IMPORTANT NOTE: Prior to submitting your abstract for consideration,
 please be advised that all conference participants are required to pay a conference
 registration fee, as well as all related travel expenses to participate in
 the symposium.
</blockquote>
<HR SIZE=3>
<CENTER> Back to ASM Call for Papers List | Back to ASM Home page</CENTER>
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<title>Materials Solutions 2000 - Materials XXI: Call for Papers</title>

<META NAME="description" Content="ASM International is the society for materials engineers, a worldwide network dedicated to advancing industry, technology, and applications of metals and materials. Through the efforts and involvement of our members, ASM develops and distributes timely, useful, reliable technical information through electronic media, publications, conferences, training programs, and chapter activities.">
<META NAME="keywords" Content="metals, metallurgy, materials, science, engineering, society, heat treatment, alloys, steel, nonferrous, ASM, ASM International, heat treating, stainless, welding, brazing, forging, casting, testing, aluminum, titanium, alloys, failure analysis">
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Call
 for Papers

<h3 align="center"> Materials
 Solutions 2000: Materials
 XXI 
 </h3>

October 9-12, 2000 
 Cervantes Convention Center 
 St. Louis, MO 
<HR WIDTH=75% SIZE=2 noshade>
 Conference First
 Announcement & Call for Papers 
Deadline for receipt of abstracts is February 15, 2000. 
<blockquote>
 Why Materials Solutions? 
 Sponsored by ASM International, the premiere Materials Information Society,
 our Materials Solutions Conference & Exposition is THE international
 engineered materials and processes event at which to present your work to
 hundreds of delegates from industry, government and academia. 
 The Technical Programming Board of ASM International solicits your
 participation in Materials XXI, Part II; a response to industrial needs
 and opportunities in the field of advanced materials required for future-generation
 technologies, as partly identified in Materials XXI, Part I, Jan. 18 & 19,
 2000, Cleveland OH. Special emphasis will be placed on future technology sector
 constraints imposed by materials. 
 The various Sector's of ASM's Technical Programming Board have already initiated
 efforts to develop responses to the futuristic scenarios cast in Materials
 XXI Part I by enrolling dynamic keynote speakers to form a framework for our
 major technical focus areas. 
 As with Part 1, Materials XXI, Part II hopes to bring together progressive
 leaders from industry, academia and government sectors to share their complimentary
 roles in materials solutions for next-generation technologies.
 Industrial Focus Areas:
 <ul>
 <li> Aerospace & Defense</li>
 <li> Heavy Equipment, Machinery & Durable Goods</li>
 <li> Energy & Utilities</li>
 <li> Automotive & Truck</li>
 <li> Electronics / Communication</li>
 </ul>
 If you wish to be a part of the special Millennium history of ASM International
 then you are invited to submit your abstract as follows: 
 Deadline for receipt of abstracts is February 15, 2000.
 Submit your abstract by February 15, 2000 and your name will be entered
 into a drawing, and you will be eligible to win a complimentary registration
 to Materials Solutions 2000. To maintain the integrity of this event, please
 carefully consider your ability to present your work at the conference before
 submitting your abstract. All costs associated with your participation at
 Materials Solutions will be at your expense, including travel, housing, and
 a (reduced) registration fee. 
 Abstract Guidelines
 <ol>
 <li> Type the titles of the conference, program, topic, and your proposed
 presentation followed by your 150-200 word abstract, in English. Include
 the significance of the presentation content, conclusions and benefits.
 </li>
 <li> For the presenting author first (please underscore name), followed
 by all co-authors of the paper, type: the complete name (including Dr./Mr./Mrs./Ms./Prof.
 etc.), title, affiliation, complete mailing address (no box numbers), telephone
 and fax numbers, and e-mail address. This information must be included
 with your abstract. </li>
 <li> Submit your abstract before February 15, 2000, online at the ASM website
 (www.asm-intl.org), click on "Call for Papers" and follow the instructions.
 Mail your abstract to Materials Solutions 2000, Conference Coordinator,
 ASM International, Materials Park, Ohio 44073-0002, or fax it to 440.338.4634.
 </li>
 </ol>
</blockquote>
<ol>
</ol>
<blockquote>
 Paper Requirements & Proceedings 
 Due to the industrial nature of this conference, manuscripts are not required
 in order to present. However, for those who would like to be published, Materials
 Solutions 2000 Conference manuscripts can be presented in one of ASM's technical
 journals, following the conference. All manuscripts submitted to a technical
 journal will be reviewed according to the selected journal's standard review
 procedure. Please indicate if you wish to be published when submitting your
 abstract so that we can send you Author Instructions. 
 Note: Manuscripts will be required in electronic format. Also, you must
 physically present your paper at the Conference if you wish to be published.
 

</blockquote>
<HR WIDTH=65%>
<blockquote>
 Online Abstract Submission 
 If you would like to submit your paper for consideration electronically, please
 review our Guidelines for Online paper submission
 before proceeding to our <A HREF="../absub/absubmit.htm">Abstract Submission
 Form</A>. You must use a browser that supports forms to take advantage of
 this method. 
 Hard Copy Abstract Submission 
 If you prefer to submit your abstract via mail or fax, please send it to the
 attention of ASM Conference Coordinator, 9639 Kinsman Rd., Materials Park,
 OH 44073-0002 Fax 440-338-4634. Abstracts submitted in hard copy should include
 up to 250 words and any relevant graphs, charts or other support data; the
 topic for which the paper is being submitted; the proposed title, conclusions
 and significance of the paper; and, the following information about the author
 and all co-authors: name, title, company/affiliation, complete address, phone
 and fax number, and e-mail address. 
</blockquote>

<blockquote>
 IMPORTANT NOTE: Prior to submitting your abstract for consideration,
 please be advised that all conference participants are required to pay a conference
 registration fee, as well as all related travel expenses to participate in
 the symposium.
</blockquote>
<HR SIZE=3>
<CENTER> Back to ASM Call for Papers List | Back to ASM Home page</CENTER>
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<title>3rd International Conference on Heat Resistant Materials Call for Papers</title>

<META NAME="description" Content="ASM International is the society for materials engineers, a worldwide network dedicated to advancing industry, technology, and applications of metals and materials. Through the efforts and involvement of our members, ASM develops and distributes timely, useful, reliable technical information through electronic media, publications, conferences, training programs, and chapter activities.">
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Call for Papers

 3rd International Conference on Heat Resistant Materials
 

<CENTER>The 3rd International Conference on Heat Resistant Materials has been postponed till 2001. Please check back for more information.</CENTER>


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<title>ImagingTech 2001: Call for Papers</title>

<META NAME="description" Content="ASM International is the society for materials engineers, a worldwide network dedicated to advancing industry, technology, and applications of metals and materials. Through the efforts and involvement of our members, ASM develops and distributes timely, useful, reliable technical information through electronic media, publications, conferences, training programs, and chapter activities.">
<META NAME="keywords" Content="metals, metallurgy, materials, science, engineering, society, heat treatment, alloys, steel, nonferrous, ASM, ASM International, heat treating, stainless, welding, brazing, forging, casting, testing, aluminum, titanium, alloys, failure analysis">
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Call for Papers

 IMAGINGTECH 2001 


<HR WIDTH=75% SIZE=2 noshade>
 The first ASM ImagingTech, held in Chicago August 17-19 1999, was a great
 success. Three days of sessions covering Imaging Theory, Hardware, Software
 and Applications, with concurrent commercial presentations, and a tabletop exhibition,
 gave those who attended all the information needed to be a better user and smarter
 consumer of imaging equipment and associated technology.
ASM will once again sponsor ImagingTech in 2001, location and date of the event
 yet to be determined. If you are interested in being an organizer, a session
 chair, speaker or exhibitor for the 2001 event, please contact Derek Weston
 (ASM Staff) on Phone. 440.338.5151 or Email <a href="mailto:dweston@po.asm-intl.org">dweston@po.asm-intl.org</a>.
 ImagingTech is a one-stop-event providing information on the latest in materials
 laboratory imaging technology. All aspects of imaging equipment - software,
 theory and applications - will be discussed with the goal of providing a clear
 understanding of the current and future available technologies and how to use
 them to best advantage. ImagingTech will offer concurrent conference and commercial
 presentation sessions and will also feature an exhibition for those who wish
 to obtain first-hand experience with some of the latest technology from many
 of the key providers within the industry.
 Those materials laboratory technicians, managers, and purchasing professionals
 involved in capital expenditure projects to maintain laboratory standards and
 performance will find this event especially relevant.
 The program will focus on the latest advancements and future trends within
 materials laboratory imaging technology, including; Theory, Hardware, Software,
 and Applications. Attendees will have the opportunity to develop a clear understanding
 of their specific organizational needs in these key areas and will learn how
 to best address them.
Foundations in Imaging
<ul>
 <li> The principles of electronic imaging.
 <ul>
 <li>Where we've been with film and where we're at with digital </li>
 <li>The future of digital and what it means to your lab</li>
 </ul>
 </li>
 <li> Issues affecting the imaging process:
 <ul>
 <li>Sample prep-setup-characterization technique, contrast, optical vs.
 electronic microscopy, electronic magnification </li>
 </ul>
 </li>
</ul>
Imaging Hardware 
<ul>
 <li> Image collection
 <ul>
 <li>Cameras: video and digital; scanners, etc. </li>
 </ul>
 </li>
 <li> Computers / storage devices:
 <ul>
 <li>Speed, monitor size, RAM, hard drive, CDROM, JAZ, etc. </li>
 </ul>
 </li>
 <li> Outputs:
 <ul>
 <li>Printers: video, digital, resolution required, speed, output quantity
 </li>
 </ul>
 </li>
 <li> Communications:
 <ul>
 <li>Internet, networks, SEM Interface, etc. </li>
 </ul>
 </li>
 <li> Turnkey system versus modular
 <ul>
 <li>Which is right for your organization? </li>
 <li>What is the cost spectrum? </li>
 <li>Learning curve considerations? </li>
 </ul>
 </li>
</ul>
Imaging Software
<ul>
 <li> Types and functionality
 <ul>
 <li>Archiving, databasing, annotation/report generation, measurement, analysis,
 compatibility </li>
 </ul>
 </li>
 <li> Turnkey system versus modular
 <ul>
 <li>Which is right for your organization? </li>
 <li>What is the cost spectrum? </li>
 <li>Learning curve considerations? </li>
 </ul>
 </li>
</ul>
Imaging Applications
<ul>
 <li> Justifying a technology upgrade
 <ul>
 <li>User needs versus process capability - what is your customer demanding?
 </li>
 <li>Comparing total cost of image capture for competitive processes </li>
 </ul>
 </li>
 <li> Integrating digital imaging throughout your organization
 <ul>
 <li>The need for a common vision in order to maximize return-on-investment
 </li>
 </ul>
 </li>
 <li> Issues for consideration when you decide to go digital:
 <ul>
 <li> Legal aspects, validation issues, documentation, accountability, etc.
 </li>
 </ul>
 </li>
 <li> End user case histories:
 <ul>
 <li>Industry (electronics, metallography, etc.); Education (students, research,
 etc.) </li>
 </ul>
 </li>
</ul>
Commercial Sessions
<ul>
 <li> Technology based presentations by leading industrial suppliers.
 <ul>
 <li>Practical, informative, solutions oriented topical papers are desired.
 Joint customer/vendor case studies or success stories also are encouraged
 and will be offered priority in the Applications Session.</li>
 </ul>
 </li>
</ul>
 
<HR WIDTH=65%>
 All abstracts of up to 200 words for presentation consideration should be
 submitted by 2 October 2000.


Online Abstract Submission 
If you would like to submit your paper for consideration electronically, please review our Guidelines for Online paper submission before proceeding to our Abstract Submission Form. You must use a browser that supports forms to take advantage of this method.


Hard Copy Abstract Submission 
 If you prefer to submit your abstract via mail or fax, please send it to the
 attention of Bridgid Ring, Conference Coordinator, 9639 Kinsman Rd., Materials
 Park, OH 44073-0002 Fax 440-338-4634. Abstracts submitted in hard copy should
 include up to 200 words and any relevant graphs, charts or other support data;
 the topic for which the paper is being submitted; the proposed title, conclusions
 and significance of the paper; and, the following information about the author
 and all co-authors: name, title, company/affiliation, complete address, phone
 and fax number, and e-mail address.

IMPORTANT NOTE: Prior to submitting your
abstract for consideration, please be advised that all conference
participants are required to pay a conference registration fee,
as well as all related travel expenses to participate in the
symposium.

<HR SIZE=3>
<CENTER> Back to ASM Call for Papers List | Back to ASM Home page</CENTER>
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Received on Tue Nov 9 09:54:38 1999

To archiwum zostało wygenerowane przez hypermail 2.1.8 : Thu 27 May 2004 - 11:16:10 MET DST