ATPC '98 Announcement and Call for Papers (fwd)

                  Krzysztof Jan Huebner

<hubner@IOd.krakow.pl> :-)

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---------- Forwarded message ----------
Date: Tue, 17 Mar 1998 19:38:53 +0900
From: Min Soo Kim <minskim@plaza.snu.ac.kr>
Subject: ATPC '98 Announcement and Call for Papers

Dear Sir/Madam:

It ia my great pleasure to contact you.
I got your e-mail address from Dr. Peter S. Gaal who was the conference
chairman of
the 24th International Thermal Conductivity Conference.
I would like to let you know that 5th Asian Thermophysical Properties
Conference (ATPC '98)
will be held in Seoul, Korea from August 30 to September 2, 1998.
Until now, more than 200 abstracts have been submitted.
We have sent acceptance letters to the authors, and full papers are to be
submitted by May 31.
I really hope you will participate ATPC '98, and make this conference very
fruitful.
If you have a mind to submit a paper, it will be my great happiness for you
to do so
not much considering the deadline.
Attached is the second announcement for your information.
For updated information, please visit us at http://atpc98.snu.ac.kr.
I really appreciate your interest in ATPC '98, and I hope to see you in Korea.

Best Regards,
Min Soo Kim
Assistant Professor
Conference Secretary General

Department of Mechanical Engineering
Seoul National University
Seoul 151-742, KOREA
(Tel) +82 2 880 8362
(Fax) +82 2 883 0179
(e-mail) minskim@plaza.snu.ac.kr
(Web Site) http://atpc98.snu.ac.kr

=================================================================
SECOND ANNOUNCEMENT AND CALL FOR PAPERS

5th Asian Thermophysical Properties Conference (ATPC '98)

August 30 - September 2, 1998

Seoul, Korea

http://atpc98.snu.ac.kr

BACKGROUND
The 5th Asian Thermophysical Properties Conference (ATPC '98) is organized
for those who are interested in thermophysical properties of fluids and
solids. This conference is one of three world-wide conferences on
thermophysical properties, two of which are European Conference on
Thermophysical Properties and the Symposium on Thermophysical Properties
(in U.S.). The past ATPC meetings had been held every three years as
follows.
   1986 in Beijing, China (chairperson B. X. Wang)
   1989 in Sapporo, Japan (chairperson N. Seki)
   1992 in Beijing, China (chairperson B. X. Wang)
   1995 in Tokyo, Japan (chairperson A. Nagashima)
This conference will provide an opportunity for scientists, researchers,
and engineers of diverse experiences to exchange current information and
new ideas on the thermophysical properties of various fluids and solids.
It also aims at presenting and discussing recent research and development
activities, present state of the art, and future directions in this area
for science and engineering applications.

TOPICS
The conference will include keynote lectures and technical sessions.
Papers are solicited which deal with several aspects of thermophysical
properties of gases, liquids, and solids. The main topics are
thermodynamic and transport properties including heat capacity, thermal
conductivity and diffusivity, thermal expansion, viscosity, thermal and
mass diffusion, speed of sound, surface tension, as well as equation of
state, phase equilibria, P-v-T behavior, critical phenomena, optical and
thermal radiative properties, structures of fluids, databases, data
correlations, computer simulations, and new measurement techniques.

Substances include new materials, composites, thin films, insulation
materials, refrigerants, working fluids, foods, bio and agricultural
materials, mixtures, crystals, semiconductor materials, molten materials,
plastics, polymers, ceramics, and others.

ABSTRACT
Authors are kindly requested to submit an abstract of an original,
unpublished work with no more than 300 English words before February 28,
1998 for initial screening. The abstract should contain; 1) title of the
paper, 2) keywords in the order of importance, 3) authors' names and
affiliations, and 4) name, full address, phone number, fax (telecopy)
number, and e-mail address of the author to whom subsequent correspondence
should be directed. The abstract should clearly state the objectives,
results, and conclusions to enable the scope and nature of the paper to be
assessed. Final acceptance will be based on the review of the abstract.
Instructions for preparing a full paper will be sent with an acceptance
letter. Authors are required to present their papers at the Conference.

LANGUAGE
English will be the official language of the conference which will be used
for all presentations and printed materials. No simultaneous translation
will be provided.

SCHEDULE
February 28, 1998 Three (3) copies of abstract due
March 31, 1998 Notification of abstract acceptance
May 31, 1998 Manuscript submission

SUBMISSION OF PAPER
Please submit three (3) copies of abstract to:
        Prof. M. S. Kim
        Secretary General of ATPC '98
        Department of Mechanical Engineering
        Seoul National University
        Seoul 151-742, KOREA
        (Tel) +82 2 880 8362
        (Fax) +82 2 883 0179
        (e-mail) minskim@plaza.snu.ac.kr

For more information, please contact or write to Secretary General.

REGISTRATION FEE
Registration fee will be US$300 per each participant before July 15, 1998.
The fee includes a full copy of the proceedings, welcome reception,
lunches, coffee breaks, and banquet. For students, the fee will be US$100
without the proceedings. After July 15, 1998, the fee for a regular
participant will be US$350, and for a student, it will be US$120.

WELCOME RECEPTION
Informal reception will be held in the evening of August 30th (Sunday) at
the Convention Center of Seoul National University with on-site
registration.

BANQUET
Banquet will be arranged in the evening of September 1st (Tuesday) in
Seoul. Registration fee will cover the banquet. Extra tickets will be
available.

PROCEEDINGS
All accepted papers and invited papers will appear in bound volumes which
will be distributed to the participants at the beginning of the conference.
Extra proceedings can be purchased during or after the conference.

RESEARCH JOURNALS
The papers presented at the Conference are encouraged to be submitted to
international journals. Those papers accepted through due review process
will be published in the special issues of International Journal of
Thermophysics (under discussion) and Fluid Phase Equilibria. The papers to
be submitted to the above research journals will be collected during the
Conference.

EXHIBITION
The exhibition of equipments, computer softwares, and books will be
provided during the Conference. For exhibition guide and information,
please contact Secretary General.

GENERAL INFORMATION

Location
The conference will be held at the Convention Center of Seoul National
University. The university is located in the south part of Seoul, Korea.
Please note that the conference location has been changed.

Accommodations
Current rate for hotel accommodations in Seoul area ranges from US$70 to
US$100 per each night. Details will be informed later.

Weather
The weather in Seoul area during the Conference period is slightly hot.
The average temperature varies between 22 and 29 oC.

Post-Conference Tour
Any participant can enjoy post-conference tour in Seoul area or to historic
city, Kyongju. Tours and programs for accompanying persons will be
available on request. During the conference, tour desk will be open for
detailed tour information.

FACTS ABOUT SEOUL
Seoul, both ancient and modern capital city of Korea, is a megapolis
intricately blended with western amenities and oriental charm. It is one
of the rare places in the world where the traditional and the modern are
harmoniously interwoven, where bustling traffic is lulled by quiet palace
gardens and modern skyscrapers are humbled by the pristine surrounding
mountains and streams. Seoul is the center of Korean culture, education,
politics and commerce. Having hosted the 1988 Summer Olympics, it is
easily accessible from every corner of the world. Shopping in Seoul is
very pleasant and sightseeing in and around the city is excellent.

INTERNATIONAL ORGANIZING COMMITTEE
Honorary members
N. Seki Hokkaido University, Japan
B. X. Wang Tsinghua University, China

Members
N. Araki Shizuoka University, Japan
M. N. Bora Gauhati University, India
Z. S. Chen Univ. of Sci. & Tech. of China, China
Y. Q. Gu Tsinghua University, China
K. Kobayasi Toyota Technological Inst., Japan
A. Nagashima Keio University, Japan
T. Ozawa Chiba Institute of Technology, Japan
S. T. Ro Seoul National University, Korea
M. Wadsley Monash University, Australia
T. G. Xi Shanghai Inst. of Ceramics, China
B. L. Zhou Institute of Metal Research, China

Corresponding member
S. Li The Nat'l Univ. of Singapore, Singapore

NATIONAL ORGANIZING COMMITTEE
C. Rhee Korea Research Institute of Standards and Science
(Conference Co-chairperson)
S. T. Ro Seoul National University (Conference Co-chairperson)
M. S. Kim Seoul National University (Secretary General)
K. O. Cha Myungji University
J. H. Hong Nat'l. Inst. of Tech. and Quality
H. Kim SNU
Y. I. Kim Korea Inst. of Science and Tech.
C. S. Lee Korea University
J. S. Paik KRISS
D. J. Seong KRISS
K.-P. Yoo Sogang University

PRE-REGISTRATION FORM

5th Asian Thermophysical Properties Conference (ATPC '98)
Aug. 30 - Sep. 2, 1998, Seoul, Korea

Please complete the following form (type or print in English) and return to
the following address:
        Prof. M. S. Kim
        Secretary General of ATPC '98
        Department of Mechanical Engineering
        Seoul National University
        Seoul 151-742, KOREA
        (Tel) +82 2 880 8362
        (Fax) +82 2 883 0179
        (e-mail) minskim@plaza.snu.ac.kr

Name: (Prof/Dr/Mr/Ms)

Affiliation (Position/Company):

Mailing Address:

Tel:

Fax:

E-mail:

( ) I plan to attend the Conference
( ) I am interested in the Conference. Please
       send more information.
( ) I intend to submit a paper with tentative title of:

=========================================
Min Soo KIM
Assistant Professor
Department of Mechanical Engineering
Seoul National University
Seoul 151-742, KOREA
(Tel) +82 2 880 8362
(Fax) +82 2 883 0179
(e-mail) minskim@plaza.snu.ac.kr
(Web Site) http://plaza1.snu.ac.kr/~metallaw
=========================================
Received on Mon Mar 23 12:45:33 1998